After reflow, carefully remove substrate with components and allow to cool.
回流后, 仔细拿开带组件的基板,并使之冷却.
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Reflow solder paste in 2 hours as soon as possible after printing.
印刷后要在2小时内回流焊膏.
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Compatible with infrared and vapor phase reflow solder process.
适用于回流焊接工艺.
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Good management for reflow and wave profile and profile board.
良好的管理为回流焊和波峰焊温度曲线及温度曲线量测板.
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The reflow process relies on the temperature profile setting.
回流过程依赖于温度曲线的设定.
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A potential reflow method - laser reflow soldering was expatiated in detail.
着重阐述了一种极具潜力的再流焊方法 ——— 激光再流焊.
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The most obvious is the necessity for increased reflow temperature.
最明显的是,使用无铅锡膏必须提高回流焊温度.
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Adapted to the reflow soldering.
适应于回流焊接.
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Hand solder is recommended instead of reflow solder.
不建议使用回流焊,推荐使用手动焊接.
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Suitable for flow and reflow soldering.
适合一般焊接及回焊.
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Do not inhale the vapor during reflow.
不要吸入回流焊时喷出的蒸气.
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Suit for reflow and wave flow solder.
适应再流焊与波峰焊.
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Clear how to measuring reflow and wave profile.
清楚怎样测量回流焊和波峰焊温度曲线.
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Suitable for SMT craft reflow soldering.
适用于回流焊SMT工艺.
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Delamination caused by electrical - over - stress ( EOS ) and moisture expansion during reflow soldering have shown different delamination patterns.
由过电应力 ( EOS ) 和再流焊中的水汽膨胀引起的分层会显示出不同的失效模式.
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